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　　X-ray multifunctional quality detectorIt is an important non-destructive testing equipment and is widely used in electronics, semiconductor and other industries. X-rays are electromagnetic waves and photons with a very short wavelength and have strong penetrating ability. The penetration effect is affected by the wavelength, density and thickness of the material being penetrated. Generally speaking, the shorter the wavelength, the greater the penetrating power; the lower the material density and the thinner the thickness, the easier it is to be penetrated. When X-rays are irradiated onto the object to be detected, due to differences in the degree of absorption of X-rays in different parts of the object, the intensity distribution of the rays transmitted through the object changes.
 

　　A data receiver is installed opposite the X-ray generator, which is responsible for automatically receiving the radiation that penetrates the object and converting it into an electrical signal. This electrical signal is then transmitted to the expansion board, processed by the computer, and presented with a specific image on the display through specialized software. These images can clearly show the structure and details inside the object, including possible defects, foreign objects, etc. Based on the different absorption of X-rays by different materials, if there are defects such as cracks, bubbles, and metal foreign objects inside the object, they will change the X-ray absorption in the local area, and then appear as abnormal areas on the formed image, thereby realizing the location and identification of defects.
 

　　X-ray multifunctional quality detectorDetermination steps:
 

　　1. Preliminary preparation and parameter setting
 

　　-Select the appropriate model: According to the requirements of the detection target, select the detector model that can meet the needs.
 

　　-Installation, connection and system settings: Complete the installation of the detector, connection with the object being measured and related system settings to ensure normal use of the equipment.
 

　　-Set emission parameters: Accurately set parameters such as voltage, current, and exposure time of X-rays based on the physical characteristics of the component being inspected, such as thickness, material, and expected defect types, because the accuracy of these parameters directly affects image quality and detection accuracy.

 

　　2. Sample positioning
 

　　-Place samples: Place samples such as electronic components to be tested on the sample stage.
 

　　-Adjust position: Adjust the position of the sample through the control system to ensure that X-rays can pass through the detected area from multiple angles to obtain more internal information and improve detection accuracy.
 

　　3. Start scanning and monitoring
 

　　-Start the equipment: Click the detection start button to start the X-ray exposure program.
 

　　-Real-time observation: Closely observe the X-ray images generated in real time with the help of the monitor to detect abnormalities in time.
 

　　-Navigation and positioning assistance: Use the navigation tool to move the detection probe to the specific location that needs to be detected; you can also rotate the sample or adjust the detection angle as needed to obtain the best viewing angle; you can also fine-tune the position to accurately locate the area to be detected in detail.
 

　　4. Image acquisition and analysis
 

　　-Collect images: During the above operation, the device will automatically collect images formed after X-rays penetrate the sample.
 

　　-Analysis results: Based on the images or data output by the equipment, the samples are analyzed to determine whether there are defects or abnormalities, and the test results are obtained.